University of Sussex is offering EPSRC Funded PhD Scholarship in Soft 3D printed structures with integrated flexible electronics.
About the project:
- Recent advances in materials science and new fabrication processes drive a paradigm shift in electrical and mechanical engineering. Instead of rigid bulky structures such as silicon wafers and metal frames, soft biomimetic approaches are envisioned.
- The aim of this project is to work on novel electronics concepts by combining deformable structures with flexible electronics to realize adaptable systems with monolithically integrated electronics for sensing applications.
- This can include interconnections made from liquid metals, soft sensors or deformable transistors. All these elements should be combined to detect parameters relevant for healthcare or soft robotics applications.
- This project combines electrical and mechanical engineering with material science and innovative fabrication methods. A particular focus will be set on using a recently acquired high resolution Optomec Aerosol Jet printer.
- Ultimately a smart biomimetic system will be realized using thin film technology and 3D printing of soft rubber materials.
Duration: 3.5 year scholarship
Scholarship value: £15,285 stipend p.a., plus full UK/EU fees.
- Applicant must hold Master’s or very good Bachelor’s degree in Engineering, Physics, Material Science, or a related field.
- Preferably experience in 3D printing, the fabrication of electronic circuits, or cleanroom processing.
How to apply:
|Organization||University of Sussex|
|Subject areas||Engineering, Physics, Material Science|
|Fellowship amount||£15,285 stipend p.a|
|Eligibility||Open to all nationalities|
|Deadline||1 October 2020|