The Excellence Scholarship: China, Taiwan, Hong Kong: Bond University is Australia’s first private, not-for-profit university, invited application for The Excellence Scholarship from eligible highly motivated citizens of China, Taiwan or Hong Kong and currently residing outside of Australia for undergraduate or postgraduate studies. The Excellence Scholarships- China, Taiwan, Hong Kong are awarded on the basis of academic excellence and are a testament to Bond University’s commitment to quality and outstanding international students.
Positions: The Excellence Scholarship
Educational qualifications: Interested and eligible students having outstanding academic ability, with high achieving A Level, IB, Australian HSC qualification results may apply for the scholarships. Candidates who are not currently completing an Australian High School equivalent in Europe are also eligible to apply. Recipients are awarded with 25% tuition remission for their selected Program.
Note: Master of Construction Practice, Master of Construction Practice (Professional), Master of Psychology, Study Abroad and Exchange Programs, Bachelor of Medical Studies and Doctor of Physiotherapy are not eligible for consideration for the Excellence Scholarship.
- Applications closed on 18 October, 2019 for students commencing in January 2020 semester.
- Applications close on 21 February, 2020 for students commencing in May 2020 semester.
- Applications close on 30 June, 2020 for students commencing in September 2020 semester.
How to apply: Interested and eligible applicants must complete the Bond University Online Application Form to receive their program offer before applying for this scholarship through the given link by or before deadline. The Europe Excellence Scholarship Application Form can be downloaded from the link given below.
Contact Address: For further information regarding the scholarships, please visit bond.edu.au/scholarships/Europe.
|Position||The Excellence Scholarship|
|Country||China, Hong Kong, Taiwan, Province of China|
|Subject areas||See the link|
|Fellowship||As per norms|
|Deadline||As described above|
For more information: For detailed announcement and instructions for submission of application, eligibility requirements, other terms and conditions, please visit the link given below.